Plastic machining, milling, buffing, flame and vapor polishing and rapid prototyping services are available. Markets served include aerospace, electronics, biomedical research, diagnostics, fluid engineering, medical, military, gene sequencing and pneumatics. Custom manufacturing of plastic components. Specializes in low to medium valve, high mix, plastic component and vertically integrated module manufacturing.
Serves semiconductor and healthcare industries. Custom manufacturer of precision machined parts and components. Capabilities include prototyping, metal and plate cutting, band sawing, ultra-sonic deburring, drilling, tapping, honing, CNC machining, notching, lathe work, turning and milling. Metal finishing services for the tooling, fluid power, electronics, medical, aerospace, defense and automotive industries. Capabilities include plating, hard anodizing, electropolishing, passivation, cleaning, buffing, abrasive blasting, texturizing and polishing.
Types of plating include gold, silver, nickel, rhodium, copper and tin. RoHS compliant. Under the same set of CMP conditions, the particle removal performance of the SC1 scrub process is compared to that of the combined SC1 megasonic tank and DI water scrub process. Table 2 shows that these two processes achieve comparable particle removal performance. The final defect counts on the wafer surface after CMP and clean not only depend on the cleaning process, but also the polishing parameters.
Table 3 shows the defect count results from two different slurries and two different CMP tools. During the CMP process and the SC1 scrub process, the wafer surface may become contaminated with metal oxide due to the high pH environment. Surface metal contamination is significantly reduced by applying dilute HCl in the second brush station Table 4. This process combines chemicals with brush scrubbing without compromising the throughput of the cleaning tool.
In order to better understand the surface metal removal process, surface SIMS is used to measure the depth profiles of three metal elements Al, Ca, K in the polished polysilicon film Figure 2. Most of the metal elements are found very near the surface, and the concentrations decrease exponentially going into the film. Dilute HCl removes most of the Al and Ca contaminants because HCl dissolves the metal oxide deposited on the wafer surface.
The new cleaning process for poly-Si provides a single-tool solution for cleaning after polysilicon CMP processing. SC1 delivered in brush box 1 during scrubbing converts hydrophobic polysilicon film after CMP to hydrophilic. Diluted HCl used in the brush scrubber in brush box 2 significantly reduces surface metallic contamination on polished polysilicon and TEOS surfaces. This single-tool SC1 scrub process achieves the same level of cleaning performance as the combined tool set of an SC1 wet bench and brush scrub process.
This new process provides an overall higher throughput CMP process without compromising final defect performance. Eugene Y. Zhao, Ph. Zhao has authored and co-authored a number of technical papers for publications in the areas of semiconductor clusters and semiconductor processing. Diane J. Hymes, Ph. Wilbur C. Krusell, Ph. He has published more than 40 technical papers and holds patents in the area of chemical processing of semiconductor wafers.
Jackie Zhang is a lab manager at OnTrak Systems, working on cleaning technology development. Prior to joining OnTrak in , she worked at the Vacuum Technology Research Institute in Beijing, China, specializing in sputtering technology and vapor deposition equipment. Ali, M. Rodder, S. Roy, G. Shinn, and M. We can help! Get In Touch. View All Tools. Handheld paddle mixer capable of mixing up to 24 gals at a time. A moveable mixer that makes pouring materials easy.
A surface preparation machine for polishing concrete and epoxy floors. This rake smooths materials with ease and features a threaded handle for adaptability. Portable air filtration to combat dust. A lightweight, dustless, high-powered vacuum. Read what our customers have to say.
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